Abstract
An electrical connector includes a dielectric housing that holds a plurality of electrical wafers. Each of the wafers includes a first side, a second side opposite the first side, and a forward mating edge. A plurality of contact pads on the first side are recessed from the forward mating edge, and a perimeter conductive trace is closer than the contact pads to the forward mating edge.
Technologies
Product
Use Cases
Services
Claim
1. An electrical connector comprising:
a dielectric housing that holds a plurality of electrical wafers, each of said wafers including a first side, a second side opposite the first side, and a forward mating edge, a plurality of contact pads on the first side which are recessed from the forward mating edge, and a conductive ground trace extending along a perimeter of the mating edge, said ground trace being separately provided from said contact pads, and said ground trace being positioned closer than the contact pads to the forward mating edge.', 'a dielectric housing that holds a plurality of electrical wafers, each of said wafers including a first side, a second side opposite the first side, and a forward mating edge, a plurality of contact pads on the first side which are recessed from the forward mating edge, and a conductive ground trace extending along a perimeter of the mating edge, said ground trace being separately provided from said contact pads, and said ground trace being positioned closer than the contact pads to the forward mating edge.
2. The electrical connector of claim 1, wherein each of said plurality of electrical wafers includes a ground plane on said second side, said conductive ground trace being connected to said ground plane.
3. The electrical connector of claim 1, wherein said forward mating edge includes chamfered corners.
4. The electrical connector of claim 1, wherein said plurality of contact pads include signal contact pads and ground contact pads, and each said conductive ground trace is disposed on said second side and further includes secondary ground traces on said second side aligned with and extending substantially parallel to said ground contact pads on said first side, said secondary ground traces extending from said perimeter conductive trace to a ground plane on said second side of said wafer.
5. The electrical connector of claim 1, wherein each of said plurality of electrical wafers further includes a mounting edge, said mounting edge including signal contact pads and ground contact pads on said first side of said electrical wafer, said mounting edge configured to be connected to a circuit board.
6. The electrical connector of claim 1, wherein said conductive ground trace is disposed on said second side of said electrical wafer.
7. The electrical connector of claim 1, wherein said housing comprises an upper housing portion and a lower housing portion, said electrical wafers received in said lower housing portion with a card edge connection.
8. The electrical connector of claim 1, wherein said plurality of contact pads include signal contact pads and ground contact pads, said signal contact pads being rearwardly recessed from said forward mating edge relative to said ground contact pads.
9. An electrical connector comprising:
a dielectric housing including a mating face and a mounting face;
a plurality of electrical wafers held within said housing, each of said wafers including a first side, a second side opposite the first side, a mating end proximate said housing mating face, and a mounting edge proximate said housing mounting face, said mating end including signal contact pads and ground contact pads on said first side of said wafer; and
an electrostatic discharge (ESD) shield integrally formed on one of the first and second sides of each said wafer, said EMI shield extending substantially adjacent and parallel to said mating end.', 'a dielectric housing including a mating face and a mounting face;', 'a plurality of electrical wafers held within said housing, each of said wafers including a first side, a second side opposite the first side, a mating end proximate said housing mating face, and a mounting edge proximate said housing mounting face, said mating end including signal contact pads and ground contact pads on said first side of said wafer; and', 'an electrostatic discharge (ESD) shield integrally formed on one of the first and second sides of each said wafer, said EMI shield extending substantially adjacent and parallel to said mating end
10. The electrical connector of claim 9, wherein said ESD shield comprises a conductive trace extending about a perimeter of said mating end of said wafer, said conductive trace joining a ground circuit on said wafer at a location rearwardly of said ground contact pads and signal contact pads
11. The electrical connector of claim 9, wherein said ESD shield comprises a conductive trace extending about a perimeter of said mating end on said second side and a secondary conductive trace aligned with and extending substantially parallel to said ground contact pads, said secondary conductive trace extending from said ground conductive trace to a ground plane rearwardly of said ground contact pads at said mating end of said wafer
12. The electrical connector of claim 9, wherein said signal contact pads are rearwardly recessed from a forward edge of said mating end of each said wafer relative to said ground contact pads
13. The electrical connector of claim 9, wherein said housing comprises an upper housing portion and a lower housing portion, said electrical wafers received in said lower housing portion with a card edge connection
14. The electrical connector of claim 9, wherein said housing comprises an upper housing portion and a lower housing portion, said upper housing portion including upper and lower shrouds proximate said mating face, said plurality of electrical wafers including mating edges that extend forwardly beyond said upper and lower shrouds
15. The electrical connector of claim 9, wherein said signal contact pads and said ground contact pads are arranged in an alternating pattern on said plurality of electrical wafers, said signal contact pads arranged in differential pairs
16. An electrical wafer for a connector comprising:
a planar substrate having a first side and an opposite second side;
a plurality of signal contact pads and ground contact pads located on said first side, said signal contact pads and ground contact pads each having a longitudinal axis, said longitudinal axis of each signal contact pad and ground contact pad extending generally parallel to one another and in a substantially perpendicular orientation with respect to the first edge, said first edge comprising a mating edge that defines a mating end; and
an electrostatic discharge (ESD) shield integrally formed on one of said first and second sides, said ESD shield extending generally parallel to said first edge and generally perpendicular to said longitudinal axis of each of the signal contact pads and the ground contact pads, said ESD shield configured to receive an ESD before the signal contact pads and the ground contact pads.', 'a planar substrate having a first side and an opposite second side;', 'a plurality of signal contact pads and ground contact pads located on said first side, said signal contact pads and ground contact pads each having a longitudinal axis, said longitudinal axis of each signal contact pad and ground contact pad extending generally parallel to one another and in a substantially perpendicular orientation with respect to the first edge, said first edge comprising a mating edge that defines a mating end; and', 'an electrostatic discharge (ESD) shield integrally formed on one of said first and second sides, said ESD shield extending generally parallel to said first edge and generally perpendicular to said longitudinal axis of each of the signal contact pads and the ground contact pads, said ESD shield configured to receive an ESD before the signal contact pads and the ground contact pads
17. The electrical wafer of claim 16, wherein said ESD shield comprises a conductive trace extending about a perimeter of said mating end, said conductive trace joining a ground plane on said second side rearwardly of said ground contact pads and signal contact pads on said first side
18. The electrical wafer of claim 16, wherein said ESD shield comprises a conductive trace extending about a perimeter of said mating end on said second side and a secondary conductive trace aligned with said ground contact pads on said first side, said secondary conductive trace extending from said perimeter conductive trace to a ground plane rearwardly of said ground contact pads.19. The electrical wafer of claim 16, wherein said signal contacts are rearwardly recessed from said mating edge relative to said ground contacts.
20. The electrical wafer of claim 16, wherein the ESD shield extends between respective ends of the signal contact pads and the ground contact pads along the mating edge.']
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SUMMARY
ClaimChart-US7044794B2-STO
Patent number:US7044794B2
Claim Chart Type : SEP Claim Chart
Price: 200 €
Note:
The information in blue was extracted from the third parties (Standard Setting Organisation, Espacenet)
The information in grey was provided by the patent holder
The information in purple was extracted from the FrandAvenue
Explicitly disclosed patent:openly and comprehensibly describes all details of the invention in the patent document.
Implicitly disclosed patent:does not explicitly state certain aspects of the invention, but still allows for these to be inferred from the information provided.
Basis patent:The core patent in a family, outlining the fundamental invention from which related patents or applications originate.
Family member:related patents or applications that share a common priority or original filing.