Abstract
A dual interface separable insulated connector comprising a faraday cage molded over a bus bar for use in an electric power system and a method of manufacturing the same are provided. The faraday cage can be disposed within a semi-conductive shell. The configuration of the separable insulated connector can provide for easier bonding between the faraday cage and insulating material. Additionally, the configuration can eliminate or reduce the need to coat the bus bar with an adhesive agent and to smooth the metal bus bar to remove burrs, other irregularities, and sharp corners from the bar. Manufacturing the dual interface separable insulated connector can include molding a semi-conductive rubber faraday cage over a conductive bus bar, inserting the faraday cage into a shell, and injecting insulating material between the faraday cage and shell.
Technologies
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Claim
1. A method for manufacturing a faraday cage for a separable insulated connector, comprising the steps of:
coupling a first set of mandrels to a conductive bus bar;
placing the conductive bus bar in a mold for the faraday cage;
injecting semi-conductive material in a liquid state into the mold such that the semi-conductive material surrounds the conductive bus bar and at least a portion of the mandrels; and
curing the semi-conductive material.', 'coupling a first set of mandrels to a conductive bus bar;', 'placing the conductive bus bar in a mold for the faraday cage;', 'injecting semi-conductive material in a liquid state into the mold such that the semi-conductive material surrounds the conductive bus bar and at least a portion of the mandrels; and', 'curing the semi-conductive material.
2. The method of claim 1, further comprising the steps of:
removing the faraday cage from the mold;
replacing the first set of mandrels with a second set of mandrels after the semi-conductive material has cured;
placing the faraday cage in a second mold;
injecting insulating material in a liquid state into the second mold; and
curing the insulating material.', 'removing the faraday cage from the mold;', 'replacing the first set of mandrels with a second set of mandrels after the semi-conductive material has cured;', 'placing the faraday cage in a second mold;', 'injecting insulating material in a liquid state into the second mold; and', 'curing the insulating material.
3. The method of claim 2, further comprising the step of replacing the second set of mandrels with a set of probes.
4. The method of claim 3, wherein the first set of mandrels comprises two mandrels, each having a first diameter,
wherein the second set of mandrels comprises two mandrels, each having a second diameter,
wherein the first diameter is greater than the second diameter, and
wherein the set of probes comprises a first probe and a second probe.', 'wherein the second set of mandrels comprises two mandrels, each having a second diameter,', 'wherein the first diameter is greater than the second diameter, and', 'wherein the set of probes comprises a first probe and a second probe.
5. The method of claim 2, wherein the insulating material comprises rubber.
6. The method of claim 1, further comprising the step of coating the conductive bus bar with an adhesive prior to placing the conductive bus bar in the mold.
7. The method of claim 1, further comprising the step of creating a first hole and a second hole in the conductive bus bar prior to placing the conductive bus bar in the mold.
8. The method of claim 1, wherein the semi-conductive material comprises a mixture comprising ethylene propylene dienemonomer rubber and a conductive material.
9. The method of claim 1, wherein the first set of mandrels comprises two steel mandrels.']
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SUMMARY
ClaimChart-US8528205B2-STO
Patent number:US8528205B2
Claim Chart Type : SEP Claim Chart
Price: 200 €
Note:
The information in blue was extracted from the third parties (Standard Setting Organisation, Espacenet)
The information in grey was provided by the patent holder
The information in purple was extracted from the FrandAvenue
Explicitly disclosed patent:openly and comprehensibly describes all details of the invention in the patent document.
Implicitly disclosed patent:does not explicitly state certain aspects of the invention, but still allows for these to be inferred from the information provided.
Basis patent:The core patent in a family, outlining the fundamental invention from which related patents or applications originate.
Family member:related patents or applications that share a common priority or original filing.